High mechanical strength, Excellent electrical insulation, Low dielectric constant and loss, Good thermal shock resistance, Outstanding flatness and surface smoothness, Exceptional chemical stability, High cost-to-performance ratio.

Surface Finishing:

As-sintered ( $Ra$ 0.3-0.5$\mu$m), Lapped, or Polished ( $Ra < 0.05\mu$ m). Available with Metallization (Mo-Mn, Ag-Pd, Au, or DBC/DPC copper coating).

Application Fields:

Hybrid Integrated Circuits (HIC), Thick-film and Thin-film circuits, LED submounts, Chip resistors and networks, Power modules, Pressure sensors, Automotive electronics, Multi-layer ceramic capacitors (MLCC).

Application Industries:

Biomedical (Implantable electronics), Advanced Machinery (Industrial sensors), New Energy (Solar inverters), Electronic Engineering (Consumer electronics), Aerospace (Communication modules), broad Semiconductor (IC packaging).

Processing Difficulties:

Maintaining ultra-tight flatness and parallelism across large-size substrates, achieving precise laser dicing and hole drilling without micro-cracks, controlling surface grain size for optimal thin-film adhesion, managing warpage during high-temperature co-firing.

Processing Flow:

Powder formulation → Tape Casting (for thin plates) or Dry Pressing → Precision Laser Scribing/Drilling → High-temperature sintering → Double-sided lapping/polishing → Metallization (optional) → 100% Dimensional and electrical inspection → Secure packaging.

Delivery Period:

Standard sizes (e.g., 4.5"x4.5"): 7-15 days, Customized or metallized substrates: 20-35 days.

Description

Our Alumina Substrates are the backbone of modern electronic packaging. Whether you require the high mechanical durability of 96% alumina for thick-film industrial sensors or the ultra-smooth surface of 99.6% alumina for precision thin-film applications, our substrates provide the perfect platform. With excellent dielectric properties and high thermal endurance, these substrates ensure the stability of electronic components under various operating conditions. We offer a full range of thicknesses and support custom laser cutting to meet your specific circuit design requirements.

Key Features:

Proven Reliability: The industry-standard material with decades of stable performance data.
Superior Surface Quality: Optimized for high-adhesion metallization and precision printing.
Thermal Endurance: Maintains structural and electrical integrity at temperatures exceeding $1000^{\circ}C$ .
High Precision: Advanced laser processing ensures tight tolerances for complex hole patterns and shapes.
Excellent Insulation: High volume resistivity prevents leakage in high-density circuit layouts.